Leading manufacturers & exporters of high grade building materials such as concrete reinforcement fibers, ar glass fibre, heat insulation coatings, frp pigment paste, industrial cellulose fibers, application in textured paints, unidirectional glass fiber mats, metallic floor hardener, sbr latex, non
Address: 218, Sagar Prabhat Co-Op Industrial Estate, Dahisar Check Naka, Dahisar (East)
Mumbai Maharashtra India 400 068
Phone:(91)-(22)-32937349
Website: https://www.eindiabusiness.com/company/81250/riddhi-enterprise-dahisar.html
Kohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature. Unlike other one component epoxies, this product can be cured at temperatures as low as 80�C. Although superlative properties are obtained with higher temperature cures, good mechanical strength properties and dimensional stability are furnished by 80�C cures as well. KB 1613 R80 offers an extensive serviceable temperature range of -70�C to +180�C. This product�s exquisite flow properties and lower exotherm makes it ideal for use in potting and encapsulation applications for 1/2� thicknesses and beyond. KB 1613 R80 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation and thermal conductivity, KB 1613 R80 also offers astounding chemical resistance to a variety of fuels, oils and water. It has a tan � yellow color. With a unique combination of remarkable performance, ease of use and speedy cures at convenient temperatures, KB 1613 R80 is widely used in electronics, aerospace, major OEM and similar applications. PRODUCT HIGHLIGHTS Thermally conductive Lower exotherm while curing Expeditious cures at 80�C or higher Superior dimensional stability Exceptional electrical insulation properties Unlimited working life at room temperature TYPICAL APPLICATIONS Potting Encapsulation Sealing Coating Bonding Packaging : Cans, Pails, Syringes Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/kb-1613-r80/
Address: 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S.Marg, Bhandup West, www.kohesibond.com
Mumbai Maharashtra India 400 078
Phone:91-22-25669144
Website: https://www.eindiabusiness.com/company/367183/kohesi-bond.html
Kohesi Bond KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70�C � 90�C for 3 � 5 hours. KB 1686 M offers a volume resistivity of 5 � 10 ohm-cm. It is ideal for use in static dissipation and EMI/RFI shielding applications. It offers an extensive serviceable temperature range of -50�C to +120�C. It is an outstanding adhesive that offers superb physical strength properties, allowing it to adhere well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.3 � 1.4 W/m/K), it also offers astounding chemical resistance to various cleaning agents, oils and water. Part A and Part B are gray in color. It has a thixotropic paste like consistency and a very low coefficient of thermal expansion (CTE). Owing to its versatile performance, KB 1686 M is widely used in electronics, aerospace, electrical, semiconductor, microwave and many OEM applications. PRODUCT HIGHLIGHTS Easy mix ratio of 1:1 by weight or volume Outstanding dimensional stability Superior thermal conductivity High lap shear strength (> 2 100 psi) Nickel filled electrically conductive 100% solids system TYPICAL APPLICATIONS Bonding Sealing Coating Packaging : Cans Industrial Certification : RoHS Compliant Learn more : http://www.kohesibond.com/product/kb-1686-m/
Address: 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S.Marg, Bhandup West, www.kohesibond.com
Mumbai Maharashtra India 400 078
Phone:91-22-25669144
Website: https://www.eindiabusiness.com/company/367183/kohesi-bond.html
Kohesi Bond KB 1040 QF is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique quartz filled epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70�C � 90�C for 2 � 3 hours. KB 1040 QF being quartz filled, offers phenomenal dimensional stability and low coefficient of thermal expansion (CTE). Additionally, it is capable of passing NASA standards for low outgassing (ASTM E-595) test. It offers an extensive serviceable temperature range of -50�C to +120�C. This superior adhesive fosters outstanding physical strength properties and offers very low shrinkage upon cure. It offers very good flow properties. In addition to superior electrical insulation, it also offers astounding chemical resistance to a variety of fuels, oils, acids, bases and water. Part A and Part B are beige in color. KB 1040 QF is widely used in optical, optoelectronic, fiber-optic, electronics, aerospace and related industries. PRODUCT HIGHLIGHTS Exceptionally low shrinkage post curing Capable of passing NASA low outgassing Superior dimensional stability Outstanding mechanical strength properties Very good electrical insulation properties Excellent flow properties TYPICAL APPLICATIONS Bonding Sealing Coating Potting Encapsulation Packaging : Cans and Pails Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595) Learn more : http://www.kohesibond.com/product/kb-1040-qf/
Address: 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S.Marg, Bhandup West, www.kohesibond.com
Mumbai Maharashtra India 400 078
Phone:91-22-25669144
Website: https://www.eindiabusiness.com/company/367183/kohesi-bond.html
Kohesi Bond KB 1631 HTC-1 is a two component epoxy system suitable for bonding and sealing. It has a 100:60 (Part A: Part B) mix ratio by weight. Most importantly, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70�C � 90�C for 3 � 5 hours. KB 1631 HTC-1 can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15�C) to +200�C. It is a phenomenal adhesive that fosters outstanding physical strength properties and low coefficient of thermal expansion (CTE). KB 1631 HTC-1 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, dimensional stability and thermal conductivity, KB 1631 HTC-1 also offers astounding chemical resistance to a variety of acids, bases, fuels, oils and water. Part A and Part B have an off-white color. Owing to its remarkable performance and vacuum compatibility KB 1631 HTC-1 is widely used in electronics, semiconductor, cryogenic and major OEM applications. PRODUCT HIGHLIGHTS Superior thermal conductivity Low coefficient of thermal expansion (CTE) Thixotropic Paste Superior dimensional stability Exceptional electrical insulation properties Capable of passing NASA low outgassing TYPICAL APPLICATIONS Bonding Sealing Packaging : Pails and Cans Industrial Certification : RoHS Compliant and NASA (Low Outgassing ASTM E-595) Learn more : http://www.kohesibond.com/product/kb-1631-htc-1/
Address: 209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S.Marg, Bhandup West, www.kohesibond.com
Mumbai Maharashtra India 400 078
Phone:91-22-25669144
Website: https://www.eindiabusiness.com/company/367183/kohesi-bond.html